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Ansys latest Simplorer version to speed IoT innovation across industries

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Voice&Data Bureau
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BENGALURU: Ansys Inc., an engineering simulation software developer headquartered in Pennsylvania, United States, has released Ansys 16.2. The new version allows engineers to create virtual prototypes of complete systems, enabling them to make significant strides in innovation and to unleash next-generation products within their industries.

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The company explained that as products — ranging from automobiles to smartphones to wearable technology — become more complex and development times continue to shrink, the need to simulate whole systems grows. Through simulation, engineers can take full advantage of the growing number of opportunities presented by the rapid innovation of materials, electronics and processes. While some manufacturers have optimized the design of components or smaller sub-systems,  the company claims that no comprehensive solution has existed for simulating complete systems. The complexity within systems arises from the challenges of connecting the individual pieces to ensure they work together as designed. Ansys assures that by developing complete virtual prototypes, leading companies can jump-start their innovation and leapfrog the competition.

“Ansys customers are already solving component and sub-system problems using the most advanced software available. But with today’s release of Ansys 16.2, they expand to the system level,” said Jim Cashman, Ansys President and CEO. “We’re offering engineers the most advanced engineering solution technologies on the market to predict real-world product performance using accurate, fast and reliable simulation. By leveraging these new capabilities, enterprises will gain competitive advantage in a competitive market,” further added Cashman.

Part of this new simulation approach is made possible by enhancements to Ansys Simplorer, a comprehensive platform for multidisciplinary systems modeling. In this new release, Simplorer can now assemble and simulate electrical, electronic, thermo-fluid, mechanical and embedded software components. The methodology offers advanced 3D precision when needed, as well as reduced-order modeling for verifying multi-domain system performance interaction.

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