MediaTek unveils T800 5G modem for innovative 5G "beyond smartphone"

MediaTek’s T800 solution supports download speeds of up to 7.9Gbps. The T800 is supported by MediaTek’s 5G UltraSave power-efficiency technologies to optimize battery life for all 5G connection conditions, allowing users to browse, stream and game for longer.

MediaTek introduced its new range, T800 chipset solution for sub-6GHz and mmWave 5G networks. This 5G solution follows the introduction of MediaTek’s T700 5G modem, and is claimed to drive innovative 5G “beyond smartphone” applications such as Industrial IoT, M2M, and always-connected PCs.

“Consumers today want the ability to access 5G speeds from anywhere. MediaTek’s newest 5G chipset solution allows end users to enjoy high-speed, low-latency 5G wherever they are – offering true computing freedom,” said JC Hsu, Corporate Vice President at MediaTek. “The T800 stands out with super fast, reliable 5G speeds in a highly efficient design that maximizes battery life for an all-around great user experience,” he added.

MediaTek’s T800 solution supports download speeds of up to 7.9Gbps. The T800 is supported by MediaTek’s 5G UltraSave power-efficiency technologies to optimize battery life for all 5G connection conditions, allowing users to browse, stream and game for longer.

According to the company,The T800’s highly design helps lower development costs and provides time-to-market advantages. The chipset solution is also believed to feature a thin modem with a fully integrated 3GPP Release-16 5G cellular modem, FR1 Transceivers, an Envelope Tracking (ET) chip, a MLNA, a GNSS receiver and associated PMICs. The modem is built on a 4nm process node and also integrates PCIe + USB host interfaces, plus other input/output options. 

Key features include:

• Download speeds of up to 7.9Gbps and upload speeds of up to 4.2Gbps.
• Support for both standalone (SA) and non-standalone (NSA) sub-6GHz and mmWave 5G. connections up to 4CC-CA, plus mixed duplex FDD/TDD support.
• Support for dual 5G SIM (DSDS), depending on device maker requirements.